Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices)
HS Code: 8486402100
SECTION 16
MACHINERY AND MECHANICAL APPLIANCES; ELECTRICAL EQUIPMENT; PARTS THEREOF; SOUND RECORDERS AND REPRODUCERS, TELEVISION IMAGE AND SOUND RECORDERS AND REPRODUCERS, AND PARTS AND ACCESSORIES OF SUCH ARTICLES
CHAPTER 84
Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof
HEADING 8486
Machines and apparatus of a kind used solely orprincipally for the manufacture of semiconductorboules or wafers
HS Code Structure Breakdown
| Level | Code | Description |
|---|---|---|
| Section | 16 | MACHINERY AND MECHANICAL APPLIANCES; ELECTRICAL EQUIPMENT; PARTS THEREOF; SOUND RECORDERS AND REPRODUCERS, TELEVISION IMAGE AND SOUND RECORDERS AND REPRODUCERS, AND PARTS AND ACCESSORIES OF SUCH ARTICLES |
| Chapter | 84 | Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof |
| Heading | 8486 | Machines and apparatus of a kind used solely orprincipally for the manufacture of semiconductorboules or wafers |
| Subheading | 848640 | Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices) |
| Commodity | 8486402100 | Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices) |
HS Code 8486402100 for Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices)
Product Wiki
Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices) has a clear classification code under the Harmonized Commodity Description and Coding System (HS Code), serving as an essential basis for customs authorities worldwide to conduct trade statistics and levy tariffs.
Cross-border trade data shows that China holds a non-negligible market share in the manufacturing and export supply of Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices), with its export volume maintaining a high level over the long term.
Governments and industry associations worldwide usually set different market access standards, quality certifications, and environmental requirements for the import and export of Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices).
With technological advancements and the diversification of market demands, the scope of application for Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices) continues to expand, driving the development of related industries.
Currently, the global supply-demand balance of Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices) is profoundly affected by macroeconomic fluctuations and geopolitics, with market prices and trade flows exhibiting cyclical variations.
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